Manufacturing Process
 
HAHA Electronics’ products use an independently developed MIDI karaoke ASIC (Application Specific Integrated Circuit, custom-made semiconductor) and are small, light, economical, reliable, fast and muti-functional. They let you enjoy not only MIDI karaoke, but also mp3 playback, voice recording, video playback and games anywhere and anytime.
 

◎ General understanding of the process of manufacturing semiconductors

◎ Wafer manufacture and circuit design
◎ Wafer processing (fabrication)
◎ Assembly and test
※ Details of manufacturing process
◎ Wafer manufacturing process
◎ Device manufacturing process
◎ Packaging

 
                     HANA Patent  SoC (system on a chip)

◎ General understanding of a semiconductor’s integrated circuit

A semiconductor’s integrated circuit is no more than a silicon chip as small and thin as a fingernail, but it can have tens of thousands to millions of electronic parts (transistors, diodes, resistors, capacitors).  It is the meticulous connection of these electronic components that result in the functions of a logic gate and storage cell. The micro components inside the chips are not made and assembled individually. That is impossible. Instead, the components and their connections are grafted onto a pattern and drawn onto multiple layers of ingredients. This is achieved by photographing the pattern and using its miniature version like the film used when finishing photos.

◎ Wafer manufacture and circuit design

1. Single crystal development
High-purity refined silicon solution is applied to a speed crystal, which is then rotated to develop a single crystal ingot.
 
2. Silicon rod cutting
The developed silicon rod is cut into thin wafers of the same thickness. The size of the wafers differ between 3\", 4\", 6\" and 8\" depending on the diameter of the silicon rod. The diameter of the silicon rods used at recent times has been increasing for increased productivity.
 
3. Wafer surface polishing
One side of the wafer is polished to produce a mirror-like surface, on which the circuit pattern is drawn.
 

4. Circuit design
A CAD (Computer Aided Design) system is used to design the electronic circuit and the actual circuit pattern to be drawn on the wafer.

 

5. Mask (reticle) manufacture
A mask (reticle) is produced by drawing the designed circuit pattern on a glass panel with an e-beam frost.

 

1. Product ordered
An order for a customized semiconductor is received.

2. Manufacture
The semiconductor is manufactured to the customer’s order over a period of 20 to 30 days.

3. Assembly
A test is conducted to check if the manufactured semiconductor is suitable for the customer’s environment.

4. Test
The finished product is tested.

4. Contract completed
The contract is completed upon delivery of the contracted goods to the customer.

 

 

 

 

 

 

HANA Electronics

Address : 

37-12, Subongro 33-gil Nam-gu,Incheon Korea.   Tel : 82-32-874-2503   Fax : 82-32-874-2502

 

 

 

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